7.4.3 Soldering Surface Mount J Lead Components Hot Gas Method

Printed Board Type: R/F/C
Skill Level: Intermediate
Conformance Level: High
Revision: D
Revision Date: Jul 7, 2000

OUTLINE

Surface Mount J Lead Component

This procedure covers the general guidelines for soldering surface mount J lead components. There is basically only one style of J lead component. Whether leads are on two sides or four sides, or whether the component is large or small, the soldering principles are the same.

ACCEPTABILITY REFERENCES
IPC-A-610 12.0	Surface Mount Assemblies
PROCEDURE REFERENCE
1.0	Foreword
2.1	Handling Electronic Assemblies
2.2	Cleaning
2.5	Baking and Preheating
7.1.1	Soldering Basics
7.1.2	Preparation For Soldering And Component Removal
7.1.3	Solder Joint Acceptability Criteria
IPC7711 5.6.3	Solder Paste Method/Hot Air Pencil

Figure 1: Add a small bead of solder paste along the row of pads.

TOOLS & MATERIALS
Cleaner
Flux
Hot Air Tool with Tips
Microscope
Solder Paste
Wipes

PROCEDURE    Preview a Video Clip   (Size - 1300KB)

1. Add a small bead of solder paste along the row of pads. (See Fig. 1).
   
   

2. Figure 2: Move the tool back and forth to heat all the solder joints until complete solder melt is observed.

   Place the component in position.
   
   
3. Adjust the pressure and temperature output of the hot air tool.
   
   
4. Direct the hot air over the component with the hot air tool tip approximately 2.50 cm (1.00") from the solder joint. This initial heating will pre-dry the solder paste.
   
   

   NOTE
   Solder paste has a dull flat appearance when dried.
   
   

5. Figure:3A - Dot indicates pin 1;B - Indicates pin 5;C - Indicates direction of pin count.

   When the solder paste has dried, move the hot air tool tip to approximately 0.50 cm (0.20") above the component. Move the tool back and forth to heat all the solder joints until complete solder melt is observed. (See Figure 2).
   
   
6. Remove the tool. Wait a moment for the solder to solidify.
   
   
7. Clean, if required and inspect.