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Circuit Technology Center
Surgeon grade rework and repair, by the book and guaranteed.
5.0 Plated Hole Procedures
Printed Board Type: N/A
Skill Level: N/A
Conformance Level: N/A
Revision: N/A
Revision Date: N/A
5.1 Plated Hole Repair, No Inner Layer Connection
Procedure covers the repair of a damaged
hole that has no inner layer connection.
5.2 Plated Hole Repair, Double Wall Method
Procedure covers use of an eyelet for the repair
of a damaged pad on a hole with an inner layer connect.
5.3 Plated Hole Repair, Inner Layer Connection
Procedure uses an eyelet to repair a plated
through hole that has an inner layer connect.
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0.0 Introduction
1.0 Foreword
2.0 Basic Procedures
3.0 Base Board Procedures
4.0 Conductor Procedures
5.0 Plated Hole Procedures
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7.0 Soldering Procedures
8.0 Component Removal
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