2.0 Basic Procedures

2.0 Basic Procedures

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	2.1 Handling Electronic Assemblies Procedure covers the proper methods for handling circuit boards.
	2.2.1 Cleaning, Local Procedure outlines bench top hand cleaning. 2.2.2 Cleaning, Aqueous Batch Process Procedure outlines water based batch cleaning.
	2.3.1 Coating Removal, Identification of Coating Procedure covers techniques for identifying various coatings and recommended coating removal methods.
	2.3.2 Coating Removal, Solvent Method Procedure uses solvent for spot removal of solder mask and surface coatings.
	2.3.3 Coating Removal, Peeling Method Procedure normally used to remove RTV silicone or other thick rubbery-like coatings.
	2.3.4 Coating Removal, Thermal Method Procedure uses a controlled, low temperature heating method to remove thick coatings.
	2.3.5 Coating Removal, Grinding/Scraping Procedure uses various grinding and scraping tools to remove coatings.
	2.3.6 Coating Removal, Micro Blasting Method Procedure uses a micro abrasive blasting system with fine abrasive powder to remove coatings.
	2.4.1 Coating Replacement, Solder Mask 2.4.2 Coating Replacement, Conformal Coating 2.4.3 Coating Replacement, Solder Mask, BGA Methods to replace coatings and solder mask.
	2.5 Baking and Preheating Procedure covers baking and preheating of circuit boards to prepare them for the subsequent operations.
	2.6.1 Legend/Marking, Stamping Method 2.6.2 Legend/Marking, Hand Lettering Method 2.6.3 Legend/Marking, Stencil Method Methods to repair or add legend and markings.
	2.7 Epoxy Mixing and Handling Procedure covers epoxy mixing and handling for various repair and rework requirements.